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PRODUCT USAGE AND APPLICATIONS
HC300 materials...
have been specifically designed to meet the exacting requirements of the PCB assembly process. HC300® materials can be used for the following applications.
- SMT Placement
- Reflow solder
- Wave solder
- Solder Paste Printing
- Conformal coating

HC300 materials by SMT Pallet...
can improve the efficiency of the PCB assembly process by,
- Eliminating the need for hand masking
- Masking bottom SMT components, enabling selective soldering
- Preventing bowing of the PCB
- Standardizing production line widths
- Increasing throughput using multi-aperture fixtures
- Reducing scrap

Ideal applications include:
- Screen Print Pallets
- Selective Solder Pallets
- Selective Flex Circuit Shilding Pallets



The above video displays limited tolerance throughout a cut sheet of SMT Pallet raw material.

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phone: 607-739-4497    |    fax: 607-739-4978    |    email: sales@smtpallet.com